Interface device accessing a stack of memory dice and a solid state disk

ABSTRACT

Memory requests for information from a processor are received in an interface device, and the interface device is coupled to a stack including two or more memory devices. The interface device is operated to select a memory device from a number of memory devices including the stack, and to retrieve some or all of the information from the selected memory device for the processor. Additional apparatus, systems and methods are disclosed.

PRIORITY APPLICATION

This is a continuation of U.S. application Ser. No. 14/610,663, filedJan. 30, 2015, which is a continuation of U.S. application Ser. No.14/076,933, filed Nov. 11, 2013, now issued as U.S. Pat. No. 8,949,538,which is a continuation of U.S. application Ser. No. 13/632,797, filedOct. 1, 2012, now issued as U.S. Pat. No. 8,583,870, which is acontinuation of U.S. Ser. No. 12/247,102, filed Oct. 7, 2008, now issuedas U.S. Pat. No. 8,281,074, all of which are incorporated herein byreference in their entirety.

BACKGROUND

Information used by a processor is often stored in a memory system thatincludes a storage device and a cache memory. The processor will requestinformation that is retrieved either from the cache memory or thestorage device. The cache memory stores much less information than thestorage device, but has a much shorter latency than the storage device.Latency is the time between initiating a request for information in amemory system and the moment the information is retrieved. The readoperation is faster when there is a lower latency.

Retrieving the information directly from the cache memory substantiallyreduces latency for the processor. When the processor runs a particularsoftware application, input/output (I/O) patterns in the informationused by the processor tend to repeat. There is a good chance thatinformation obtained from the storage device will be retrieved again.The cache memory stores information most recently accessed by theprocessor. When the processor requests information that is in the cachememory, the slower storage device does not need to be accessed and theinformation is retrieved directly from the faster cache memory. Thecache memory reduces the number of times that information is retrievedfrom the storage device. The cache memory improves the performance ofthe memory system by reducing an average latency for informationrequested by the processor.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a block diagram of a system according to various embodimentsof the invention.

FIG. 2 is a flow diagram of a method according to various embodiments ofthe invention.

FIG. 3 is a block diagram of a system according to various embodimentsof the invention.

FIG. 4 is a partial cross section of an integrated circuit packagehaving multiple separate integrated circuit (IC) dice arranged in astack according to various embodiments of the invention.

FIG. 5 is a block diagram of a system according to various embodimentsof the invention.

FIG. 6 is a block diagram of a system according to various embodimentsof the invention.

DETAILED DESCRIPTION

Systems including a processor and multiple memory devices typically havethe processor decide which memory device is to provide information usedby the processor. When the processor does not have this information, apage fault occurs and the operating system (OS) of the processor beginsa disk I/O routine to retrieve the information. The disk I/O routine issoftware that selects one or more external memory devices storing theinformation and retrieves the information from the selected memorydevices. The processor includes hardware to manage a transfer of theinformation from a cache memory device or a storage device to theprocessor. The disk I/O routine takes a substantial amount of time toretrieve the information.

The inventor has discovered that the challenge noted above, as well asothers, can be addressed by performing a cache tag look-up routine in aninterface device separate from a processor. The interface device iscoupled between the processor and multiple memory devices to receive amemory request from the processor and to retrieve information for theprocessor from one or more of the memory devices. The memory request isa request for information stored in the memory devices. The informationincludes one or more of data, address and control information or otherinformation. The memory devices include a stack of memory devices thatoperate as a cache memory. The interface device attempts to retrieve theinformation from the cache memory. If the information is not in thecache memory, the interface device retrieves it from a storage devicesuch as a dual in-line memory module (DIMM) or a solid state disk. Theprocessor and its OS are not involved in retrieving the information. Theprocessor sees the interface device and the memory devices to be asingle entity providing the information.

FIG. 1 is a block diagram of a system 100 according to variousembodiments of the invention. The system 100 includes a processor 110coupled through a bus 112 to an interface device 116 and a solid statedisk 117 coupled through a bus 118 to the interface device 116. Thesolid state disk 117 is a flash memory device. The system 100 alsoincludes a stack 120 including IC dice and channels according to variousembodiments of the invention. A stack of IC dice includes a collectionof IC dice coupled together to exchange data, address and controlsignals. The stack 120 includes the interface device 116 and separate ICdice 124, 126 and 128, coupled to a number of channels 131, 132, 133,134, 135, 136, 137 and 138 to transfer information. The stack 120 mayinclude more channels. Each of the channels 131-138 may be anelectrically conductive path to carry signals between the IC dice 124,126 and 128 and the interface device 116. The channels 131-138 are alsocoupled to the interface device 116.

The interface device 116 is formed of semiconductor material withelectronic circuitry including logic circuitry. Each of the IC dice 124,126 and 128 is a memory device, such as a dynamic random access memory(DRAM) device, formed of semiconductor material with electroniccircuitry that includes respective control logic circuits 154, 156 and158 and respective arrays 164, 166 and 168 of memory cells. The IC dice124, 126 and 128 may communicate with each other through the channels131-138 and with the processor 110 through the interface device 116.Other devices such as the solid state disk 117 and other memory devicesmay be coupled to the interface device 116 to communicate with theprocessor 110 or the IC dice 124, 126 and 128.

The processor 110, the interface device 116 and the solid state disk 117may be arranged on a circuit board having a planar surface extending inan X direction and a Y direction substantially orthogonal to the Xdirection. The channels 131-138 extend in a Z direction from theinterface device 116 through or into the IC dice 124, 126 and 128, withthe Z direction being substantially orthogonal to the X direction andthe Y direction. The stack 120 may include more or fewer IC diceaccording to various embodiments of the invention.

Information exchanged between the processor 110 and the solid state disk117 is controlled by a control circuit 170 in the interface device 116.The information includes one or more of data, address and controlinformation or other information. Information exchanged on the bus 118between the interface device 116 and the solid state disk 117 iscontrolled by a sequencer 172. The sequencer 172 generates addressesused to step through the exchange of information on the bus 118. A writebuffer 174 in the interface device 116 stores information to betransmitted on the bus 118 and information received from the bus 118 isstored in a read buffer 176 in the interface device 116.

Information exchanged between the processor 110 and the IC dice 124, 126and 128 is controlled by a cache control circuit 177 in the interfacedevice 116. The information includes one or more of data, address andcontrol information or other information. Information exchanged on thechannels 131-138 between the interface device 116 and the IC dice 124,126 and 128 is controlled by a sequencer 182. A write buffer 184 in theinterface device 116 stores information to be transmitted on thechannels 131-138 and information received from the channels 131-138 isstored in a read buffer 186 in the interface device 116.

The interface device 116, the solid state disk 117 and the IC dice 124,126 and 128 are components of a tiered memory system in which the ICdice 124, 126 and 128 are operated as a cache memory and the solid statedisk 117 is operated as a storage device. Other memory devices (notshown) such as a flash DIMM and a DRAM DIMM may be coupled to theinterface device 116 as additional storage devices. The interface device116 receives a memory request for information from the processor 110 andexecutes a cache tag look-up to retrieve the information and transmit itto the processor 110. The cache tag look-up is based on a 4 KByte pageaddress according to various embodiments of the invention.

The interface device 116 executes the cache tag look-up to determine ifthe information is in the stack 120 or one or more of the storagedevices, and then to select the stack 120 and/or one or more of thestorage devices if they do contain some of the information. Theinterface device 116 is operated to select the stack 120 and/or one ormore of the storage devices having the shortest latency for theinformation. If at least a portion of the information is located in thestack 120, then some or all of the information is retrieved from the ICdice 124, 126 and 128. Some or all of the information is retrieved fromone or more of the storage devices having the shortest latency such asthe solid state disk 117 or the other memory devices if all of theinformation is not located in the stack 120. A disk I/0 routine is notperformed by the processor 110. The control of information exchangedbetween the processor 110, the IC dice 124, 126 and 128 and the solidstate disk 117 through the interface device 116 will be described inmore detail with reference to FIG. 2.

A logical block address (LBA) is an address used by an OS to locate ablock of data stored in a flash memory device. A physical block address(PBA) is the physical address of the block of data in the flash memorydevice and may be different from the LBA. A LBA-to-PBA look-up table,also called a LBA table, is used to find the PBA for a LBA. during aread or a write. Cache tag values correspond with addresses of blocks ofdata in storage devices that are currently copied to a cache memorydevice. The cache tag values indicate whether a block of data is storedin the cache memory device. Cache tag values or LBA tables, or both, maybe stored in the IC dice 124, 126 and 128.

The IC dice 124, 126 and 128 may be partitioned into multiple types ofmemory including the cache memory according to various embodiments ofthe invention. The IC dice 124, 126 and 128 may include DRAM devices,flash memory devices, or a combination of flash memory devices and DRAMdevices according to various embodiments of the invention. The stack 120shown in FIG. 1 includes a specific number of channels as an example.The number of channels in the stack 120 may vary. For example, the stack120 may include tens, hundreds, or thousands of channels extendingthrough or into the IC dice 124, 126 and 128 in the stack 120. Thechannels enable high speed communication between the interface device116 and the IC dice 124, 126 and 128.

FIG. 2 is a flow diagram of a method 200 according to variousembodiments of the invention. In block 210, the method 200 starts. Inblock 220, a memory request for information from a processor is receivedin an interface device, the interface device being separate from theprocessor. In block 230, a cache tag look-up routine is performed in theinterface device to select one or more of a stack including memorydevices and a solid state disk coupled to the interface device. In block240, some or all of the information that is stored in the stack isretrieved for the processor. In block 250, some or all of theinformation is retrieved from the solid state disk if less than all ofthe information is stored in the stack. In block 260, the method 200ends.

The individual activities of the method 200 do not have to be performedin the order shown or in any particular order. Some activities may berepeated, and others may occur only once. Various embodiments may havemore or fewer activities than those shown in FIG. 2.

FIG. 3 is a block diagram of a system 300 according to variousembodiments of the invention. The system 300 includes a processor 310coupled through a narrow high-speed bus 312 to an interface device 316.A collection of separate IC dice 320, 324, 326 and 328 are coupled tothe interface device 316 through a wide bus 330 to transfer informationbetween the interface device 316 and the IC dice 320, 324, 326 and 328.The interface device 316 is a separate IC die. The interface device 316,the bus 330 and the IC dice 320, 324, 326 and 328 are arranged in astack 340.

Each of the IC dice 320, 324, 326 and 328 may be a memory device such asa DRAM device or a flash memory device. The IC dice 320, 324, 326 and328 may communicate with each other through the bus 330 and with theprocessor 310 through the interface device 316. The stack 340 mayinclude more or fewer IC dice according to various embodiments of theinvention.

The system 300 includes a flash DIMM 350 coupled to a solid state drive(SSD) control circuit 354 through a number of bidirectional channels358. The SSD control circuit 354 is coupled through a narrow high-speedbus 360 to the interface device 316. The system 300 also includes a DRAMDIMM 370 coupled through a bus 376 to the interface device 316.

The interface device 316, the flash DIMM 350, the DRAM DIMM 370 and theIC dice 320, 324, 326 and 328 are components of a tiered memory systemin which the IC dice 320, 324, 326 and 328 are operated as a cachememory and the flash DIMM 350 and the DRAM DIMM 370 function as storagedevices. The IC dice 320, 324, 326 and 328 may be partitioned intomultiple types of memory including the cache memory according to variousembodiments of the invention. Other memory devices (not shown) may becoupled to the interface device 316 to provide additional storage. Theinterface device 316 receives a memory request for information from theprocessor 310 and executes a cache tag look-up routine to retrieve theinformation and supply it to the processor 310. The information isretrieved from the IC dice 320, 324, 326 and 328, if stored there, andfrom storage devices such as the flash DIMM 350 and the DRAM DIMM 370 ifsome or all of the information is not located in the IC dice 320, 324,326 and 328. A disk I/O routine is not performed by the processor 310.Cache tag values or LBA tables, or both, may be stored in the IC dice320, 324, 326 and 328.

FIG. 4 is a partial cross section of an integrated circuit package 400having multiple separate IC dice 401, 402, 403 and 404 arranged in astack 407 according to various embodiments of the invention. Each of theIC dice 401, 402, 403 and 404 is formed from a semiconductor materialand includes electronic circuitry. The IC dice 401, 402, 403 and 404 mayeach include circuit components of a single memory device.Alternatively, the IC dice 401, 402, 403 and 404 collectively mayinclude circuitry of a memory device. One of the IC dice 401, 402, 403and 404 may include circuit components of an interface device accordingto various embodiments of the invention.

The package 400 includes a group 420 of channels 431, 432, 441, 442 and443. Each channel 431, 432, 441, 442 and 443 is shown as a broken linein FIG. 4 that extends through or into the IC dice 401, 402, 403 and 404in the stack 407. Each channel 431, 432, 441, 442 and 443 may be aconductive path and may be referred to as a “through wafer interconnect”(TWI) or a “through silicon via” (TSV).

The package 400 includes a support 450 coupled to the IC dice 401, 402,403 and 404. The support 450 may be a ceramic or organic packagesubstrate. Multiple con acts 454 are coupled to the support 450 toenable the IC dice 401, 402, 403 and 404 to communicate with anotherdevice such as a processor or a solid state disk (not shown). Some ofthe contacts 454 may form portions of the channels 431, 432, 441, 442and 443. The package 400 includes an enclosure 460 which may enclose atleast a part of the support 450 and the IC dice 401, 402, 403 and 404.An interior space 462 between the enclosure 460 and the IC dice 401,402, 403 and 404 may be filled with a filling material, a gas, a liquid,or a combination thereof. The filling material may include a polymermaterial.

An interface device may be located in the die 404 and this interfacedevice may be similar to or identical to the interface device 110 shownin FIG. 1 or the interface device 310 shown in FIG. 3. The interfacedevice may include circuit components, such as buffers and I/O drivers,to facilitate the transfer of information at appropriate data transferrates between the IC dice 401, 402 and 403 and another device such as aprocessor or a solid state disk (not shown).

The IC dice 401, 402, 403 and 404 can be substantially equal in size andare stacked vertically on, or with respect to, the support 450. In otherwords, the IC dice 401, 402, 403 and 404 are stacked along a linesubstantially perpendicular to a larger surface of the support 450.

The IC dice 401, 402, 403 and 404 may be formed separately and thenarranged in the stack 407 as shown in FIG. 4. The IC dice 401, 402, 403and 404 are attached to each other at a number of joints 470. Each joint470 is located between two of the IC dice 401, 402, 403 and 404. Eachjoint 470 includes two bond pads 472, with one bond pad 472 beingadhered to each respective die 401, 402, 403 and 404, and anelectrically conductive material 474 between the bond pads 472. Theconductive material 474 may include one or more of solder, copper, or aconductive adhesive.

Each channel 431, 432, 441, 442 and 443 includes at least one via 480with a conductive material inside the via 480. A via 480 in one of theIC dice 401, 402, 403 and 404 is coupled to a via 480 in another one ofthe IC dice 401, 402, 403 and 404 through one of the joints 470 thatcouple distal ends of the vias 480 to each other. The vias 480 canextend all the way through some of the IC dice 402, 403 and 404 andextend into, but not through, another die, such as the die 401. Theconductive material inside the vias 480 may include one or more ofsolder, copper, or another conductive material.

The group 420 of channels includes a specific number of channels as anexample. The number of channels in the group 420 may vary. For example,the group 420 may include tens, hundreds, or thousands of channelsextending through or into the IC dice 401, 402, 403 and 404. Thechannels in the group 420 enable high speed communication between the ICdice 401, 402, 403 and 404.

The stack 407 may be formed in a flip-chip fashion in which the die 401is used as abuse as shown in FIG. 4. The die 402 is attached to the die401, the die 403 is then attached to the die 402, and finally the die404 is attached to the die 403. The conductive material 474 is used tobond the bond pads 472 of one die to the bond pads 472 of another diewhile the IC dice 401, 402, 403 and 404 are assembled in the stack 307.After the IC dice 401, 402, 403 and 404 are assembled in the stack 407,they may be flipped over and then attached at the die 404 to the support450. The package 400 may be assembled using other techniques accordingto various embodiments of the invention. The stack 407 may include moreor fewer IC dice according to various embodiments of the invention.

FIG. 5 is a block diagram of a system 500 according to variousembodiments of the invention. The system 500 includes a processor 510coupled through a narrow high-speed bus 512 to an interface device 516.A collection of separate IC dice 520, 524, 526, 528, 530, 534, 536 and538 are coupled to the interface device 516 through a wide bus 540 totransfer information between the interface device 516 and the IC dice520, 524, 526, 528, 530, 534, 536 and 538. The interface device 516 is aseparate IC die. The interface device 516, the bus 540 and the IC dice520, 524, 526, 528, 530, 534, 536 and 538 are arranged in a stack 550.

Each of the IC dice 520, 524, 526, 528, 530, 534, 536 and 538 may be amemory device such as a DRAM device or a flash memory device. The ICdice 520, 524, 526, 528, 530, 534, 536 and 538 may communicate with eachother through the bus 540 and with the processor 510 through theinterface device 516. The stack 550 may include more or fewer IC diceaccording to various embodiments of the invention.

The system 500 also includes a DRAM DIMM 570 coupled through a bus 576to the interface device 516. Information exchanged between the processor110 and the DRAM DIMM 570 is controlled by a control circuit 580 in theinterface device 116. Information exchanged between the processor 510and the IC dice 520, 524, 526 and 528 is controlled by a cache controlcircuit 584 in the interface device 516. Information exchanged betweenthe processor 510 and the IC dice 530, 534, 536 and 538 is controlled bya solid state drive (SSD) control circuit 588 in the interface device516. The information exchanged between the processor 510, the IC dice520, 524, 526, 528, 530, 534, 536 and 538 and the DRAM DIMM 570 includesone or more of data, address and control information or otherinformation.

The interface device 516, the DRAM DIMM 570 and the IC dice 520, 524,526, 528, 530, 534, 536 and 538 are components of a tiered memory systemin which the IC dice 520, 524, 526 and 528 are operated as a cachememory and the IC dice 530, 534, 536 and 538 and the DRAM DIMM 570function as storage devices. Other memory devices (not shown) may becoupled to the interface device 516 to provide additional storage. Theinterface device 516 receives a memory request for information from theprocessor 510 and executes a cache tag look-up routine to retrieve theinformation and supply it to the processor 510. The information isretrieved from the IC dice 520, 524, 526 and 528 if stored there, andfrom storage devices such as the IC dice 530, 534, 536 and 538 and theDRAM DIMM 570 if some or all of the information is not located in the ICdice 520, 524, 526 and 528. A disk I/O routine is not performed by theprocessor 510. Cache tag values or LBA tables, or both, may be stored inthe IC dice 520, 524, 526, 528, 530, 534, 536 and 538.

FIG. 6 is a block diagram of a system 600 according to variousembodiments of the invention. The system 600, in some embodiments, mayinclude a processor 604 coupled to a display 608 and/or a wirelesstransceiver 612 through a bus 613. The display 608 may be used todisplay data, perhaps received by the wireless transceiver 612. Thesystem 600 includes memory devices such as a DRAM DIMM 614 including aplurality of DRAM devices and/or a flash DIMM 615 including a pluralityof flash memory devices. The flash DIMM 615 is a solid state disk. TheDRAM DIMM 614 is coupled to exchange information with an interfacedevice 616 over a bus 617. The flash DIMM 615 is coupled to exchangeinformation with the interface device 616 over a bus 618. The processor604 is coupled to exchange information with the interface device 616over a bus 619. The DRAM devices in the DRAM DIMM 614 may be synchronousDRAM (SDRAM) devices.

The system 600 includes a cache memory device 620 with several separateIC dice (not shown). Each of the IC dice is a DRAM device or a flashmemory device according to various embodiments of the invention. Thecache memory device 620 and the interface device 616 are components of astack that may be similar to the stack 120 shown in FIG. 1, the stack340 shown in FIG. 3, the stack 407 shown in FIG. 4, or the stack 550shown in FIG. 5. The cache memory device 620 is coupled to exchangeinformation with the interface device 616 over a number of channels 624.Each of the channels 624 may be an electrically conductive path.

In some embodiments, the cache memory device 620 is a single memorydevice such as a DRAM device or a flash memory device coupled toexchange information with the interface device 616 through a bus (notshown).

In some embodiments, the system 600 may include a camera that includes alens 679 and an imaging plane 680 to couple to the processor 604 throughthe bus 613. The imaging plane 680 may be used to receive light capturedby the lens 679.

Many variations are possible. For example, in some embodiments, thesystem 600 may include a cellular telephone receiver 682 forming apinion of the wireless transceiver 612. The cellular telephone receiver682 may also receive data to be processed by the processor 604 anddisplayed on the display 608. In some embodiments, the system 600 mayinclude an audio, video, or multi-media player 684, including a memorydevice 685 and a set of media playback controls 686 to couple to theprocessor 604 through a bus 687. The processor 604 may also be coupledto exchange information with an audio device 692 and/or a modem 694through a bus 695.

Any of the electronic components of the system 600 may transmit data toother components of the system 600 according to embodiments of theinvention described herein.

Systems including a processor and multiple memory devices presentedherein may provide increased efficiency by performing a cache taglook-up routine in an interface device separate from the processor. Theprocessor and its OS are not involved in retrieving information from thememory devices. The processor sees the interface device and the memorydevices to be a single entity providing the information. This can leadto a significant performance improvement.

Any of the circuits or systems described herein may be referred to as amodule. A module may comprise a circuit and/or firmware according tovarious embodiments.

1. (canceled)
 2. A method, comprising: receiving, in an interface devicecoupled to multiple memory devices and at east one storage device, amemory request for selected information; performing a cache tag look-uproutine in the multiple memory devices and the at least one storagedevice, the cache tag lookup-up routine performed by the interfacedevice; determining that only a first portion of the selectedinformation is in a first of the memory devices; accessing the firstmemory device to retrieve the first portion of the selected informationand storing the retrieved first portion of the selected information asfirst information in the interface device; determining that a secondportion of the selected information is in a second of the multiplememory devices or in the at least one storage device; accessing thesecond memory device or the at least one storage device to retrieve thesecond portion of the selected information from the non-volatile memorydevice, as second information, and storing the second information in theinterface device.
 3. The method of claim 2, further comprisingtransmitting the first information and the second information to adevice that transmitted the memory request.
 4. The method of claim 3,wherein the device hat transmitted the memory request is a processor. 5.The method of claim 4, wherein the processor does not perform a diskinput/output routine to retrieve the first information and the secondinformation.
 6. The method of claim 2, wherein the multiple memorydevices are arranged in a stack.
 7. The method of claim 6, wherein thestack includes multiple dynamic random access memory (DRAM) devicescoupled to the interface device through a plurality of channels.
 8. Themethod of claim 2, wherein the memory devices include multiple dynamicrandom access memory (DRAM) devices.
 9. The method of claim 2, whereinthe at least one storage device comprises non-volatile memory.
 10. Themethod of claim 2, wherein the at least one storage device comprises atleast one solid-state disk (SSD).
 11. A method, comprising: sending amemory request for selected information from a processor to an interfacedevice coupled to a stack including two or pry devices and to at leastone storage device; and receiving the information in the processor fromthe interface device after the interface device has, performed a cachetag look-up routine to select a device from a storage device and thestack based upon the device having the shortest latency for retrievingat least a portion of the selected information, retrieved and stored theselected information, and transmitted the information to the processor.12. The method of claim 11, wherein the interface device has further:determined that the selected device contains only a first portion of theselected information; and retrieved at least a second portion of theselected information from a storage device.
 13. The method of claim 11,wherein the stack including two or more memory devices comprises one ormore of a dynamic random-access memory (DRAM) device and a flash memorydevice.
 14. The method of claim 11, further comprising storing cache tagvalues or logical block address (LBA) tables in the stack.
 15. Themethod of claim 11, wherein the processor does not perform a diskinput/output routine to retrieve the selected information.
 16. A systemcomprising: a processor; multiple memory devices; at least one storagedevice; and an interface device coupled to the processor, the multiplememory devices, and the at least one storage device, the interfacedevice configured to, receive a memory request for selected information;in response to receipt of the memory request, perform a cache taglook-up routine in the multiple memory devices and the at least onestorage device; determine that only a first portion of the selectedinformation is in a first of the memory devices; access the first memorydevice to retrieve the first portion of the selected information andstore the retrieved first portion of the selected information as firstinformation in the interface device; determine that a second portion ofthe selected information is in a second of the multiple memory devicesor in the at least one storage device; and access the second memorydevice or the at least one storage device to retrieve the second portionof the selected information from the non-volatile memory device assecond information, and store the second information in the interfacedevice.
 17. The system of claim 16, wherein the interface device isfurther configured to transmit the first information and the secondinformation to a device that transmitted the memory request.
 18. Thesystem of claim 16, wherein the multiple memory devices are arranged ina stack.
 19. The system of claim 18, wherein the stack includes multipledynamic random access memory (DRAM) devices coupled to the interfacedevice through a plurality of channels.
 20. The system of claim 16,wherein the multiple memory devices include multiple dynamic randomaccess memory (DRAM) devices.
 21. The system of claim 16, wherein the atone storage device comprises at least one solid-state disk (SSD).